MEMS Mechanical Sensors

本書は、MEMSセンサーの設計・シミュレーション・製造・応用における問題を克服しなければならないとき、手元に置いておくと便利な書籍です。本書は、ツールやパッケージングの設計のための実践的なガイドブックで、メカニカル・マイクロセンサのあらゆる応用に必要となるセンサを作成する上で役立ちます。スマートセンシングのみならず、ピエゾ抵抗・圧電・電気容量・光学・共振・アクチュエーション・熱・磁性を含む、重要な物理的センシング技術についてカバーされています。

Introduction - Motivation. Physical Sensors. Market Review: Current and Future. Why MEMS? Si Properties.

Materials and Fabrication Techniques - Silicon, Oxide and Nitride, SOI. Metalization. Glass Pyrex, Quartz, SiC, Diamond, Sapphire. Epitaxy. Oxidization. Thin Film Techniques (CD, Sputtering, LB, Spin-on Methods, Sol-Gel). Thick-Film. Anodic Bonding. Fusion Bonding. Surface Micromachining. Bulk Micromachining. DRIE. LIGA. Photolithography, E-Beam.

Design Tools - System Level Design. Review of MEM Packages. Finite Analysis and Methods. Thermal Design Issues: How It痴 Done. Simulation. Masks, CAD Layout, LEDit, Cadence, etc.

Packaging - Types of Standard Packages. Wire Bonding Methods. Thermal Issues. Stress Isolation. Coatings. Hermetic Sealing and Vacuum Packaging.

Physical Sensing Techniques - Piezoresistive. Piezoelectric. Capacative. Optical. Resonant. Actuation Techniques. Thermal. Magnetic. Smart Sensors, CMOS, and SOI.

Pressure Sensors - Commercial Devices. Research Devices. Future Devices.

Force and Torque Sensors - Commercial Devices. Research Devices. Future Devices.

Inertial Sensors - Commercial Devices. Research Devices. Future Devices.

Flow Sensors for Microfluidics - Commercial Devices. Research Devices. Future Devices.

Displacement Sensors - Commercial Devices. Research Devices. Future Devices.